With the improvement of the overall performance of computer technology, the operating frequency of the various components are also increasing, along with increased power consumption, heat dissipation has become a very critical technical issues. Emissions related to the heat stability and the product life of the entire system. Especially for laptop computers and some small mobile terminal products, effective heat dissipation has a very important significance.
Laptop cooling device
(1) heat pipes
The heat pipe can efficiently conducting heat from one end to the other end. It is more than 20cm long, diameter 0.5cm, which has fiber and water, evacuated tube, one end close to the CPU, the other end away from the CPU and an external heat sink or fan heatsink. Its working principle is: in a vacuum, the boiling point of water is very low, if heated at one end of the pipe, the water will evaporate, the tropics to the other side, to the other side, the water will cool down, and then flow back, so the cycle heat is constantly moving, like the principle of air-conditioners. The advantage is that no moving parts, all parts are sealed included, do not consume energy, but also because it is completely sealed, it is always valid.
Laptop cooling tube
(2) heat dissipation plate
Bottom and upper board, each with a piece of metal heat sink, there is help in the location of the CPU cooling system receives heat from the processor to generate and import it into the heat pipe. These heat to be conducted through the heat pipe along the entire metal heat sink. Located in the upper part of the cooling plate motherboard and keyboard contact, heat will be discharged from the keyboard.
Board in the metal heat sink
(3) the metal frame mold
Except for the two heat pipes and double heat dissipation plate, and a portion is also exposed to the heat source, it is the peripheral interface of the stent, the rear end is located in the computer, and exposed to the air. Therefore, we also used this piece of metal, the heat generated by the bottom of the processor, peripherals connected via the rear part of the conduction out. Currently on the market there are many laptop computers have adopted internal heat dissipation and also lightweight "magnesium alloy" as a framework for the laptop.
Aluminum-magnesium alloy die laptop
However, due to structural laptop itself determines its thermal performance is not particularly good, such as the outbreak of a certain brand of graphics card door thing that is the culprit because of poor laptop cooling induced by the exposure of its graphics design flaws. So, this coupled with a radiator based on hot summer days is good way to avoid the tragedy.
Laptop cooling device
(1) heat pipes
The heat pipe can efficiently conducting heat from one end to the other end. It is more than 20cm long, diameter 0.5cm, which has fiber and water, evacuated tube, one end close to the CPU, the other end away from the CPU and an external heat sink or fan heatsink. Its working principle is: in a vacuum, the boiling point of water is very low, if heated at one end of the pipe, the water will evaporate, the tropics to the other side, to the other side, the water will cool down, and then flow back, so the cycle heat is constantly moving, like the principle of air-conditioners. The advantage is that no moving parts, all parts are sealed included, do not consume energy, but also because it is completely sealed, it is always valid.
Laptop cooling tube
(2) heat dissipation plate
Bottom and upper board, each with a piece of metal heat sink, there is help in the location of the CPU cooling system receives heat from the processor to generate and import it into the heat pipe. These heat to be conducted through the heat pipe along the entire metal heat sink. Located in the upper part of the cooling plate motherboard and keyboard contact, heat will be discharged from the keyboard.
Board in the metal heat sink
(3) the metal frame mold
Except for the two heat pipes and double heat dissipation plate, and a portion is also exposed to the heat source, it is the peripheral interface of the stent, the rear end is located in the computer, and exposed to the air. Therefore, we also used this piece of metal, the heat generated by the bottom of the processor, peripherals connected via the rear part of the conduction out. Currently on the market there are many laptop computers have adopted internal heat dissipation and also lightweight "magnesium alloy" as a framework for the laptop.
Aluminum-magnesium alloy die laptop
However, due to structural laptop itself determines its thermal performance is not particularly good, such as the outbreak of a certain brand of graphics card door thing that is the culprit because of poor laptop cooling induced by the exposure of its graphics design flaws. So, this coupled with a radiator based on hot summer days is good way to avoid the tragedy.
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